{
	"title": "Intel(R) Flip Chip Ball Grid Array (FCBGA1, FCBGA3, FCBGA5) Chipsets and Advanced Memory Buffer (AMB), PCN 108251-01, Product Material, solder resist material change, Reason for Revision: Change in substrate delivery schedule",
	"id": "807213",
	"created_at": "2023-12-21T09:42:16+00:00",
	"modified_at": "2008-04-10T00:00:00+00:00",
	"description": "Chipsets - Desktop, Chipsets - Mobile, Chipsets - Workstation Server, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.",
	"download_url": "https://cdrdv2-public.intel.com/807213/PCN108251-01.pdf",
	"html_url": "https://intel.com/content/www/us/en/content-details/807213/intel-r-flip-chip-ball-grid-array-fcbga1-fcbga3-fcbga5-chipsets-and-advanced-memory-buffer-amb-pcn-108251-01-product-material-solder-resist-material-change-reason-for-revision-change-in-substrate-delivery-schedule.html",
	"url": "https://intel.pcn.captnemo.in/pcn/807213",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/807213.json"
}