{
	"title": "Intel(R) SMARTi (TM) UE2,  PMB5712A1, PCN 111111-01, Manufacturing Site, Manufacturing Site, Material Change, Change to Overmold eWLB process, STATS ChipPAC, Reason for Revision: Removing Device Description Document",
	"id": "805401",
	"created_at": "2023-12-20T14:26:44+00:00",
	"modified_at": "2011-12-19T22:00:00+00:00",
	"description": "Chipsets - Mobile IMC, Manufacturing Site, Intel anticipates no impact to customers, see PCN detail for further information.",
	"download_url": "https://cdrdv2-public.intel.com/805401/PCN111111-01.pdf",
	"html_url": "https://intel.com/content/www/us/en/content-details/805401/intel-r-smarti-tm-ue2-pmb5712a1-pcn-111111-01-manufacturing-site-manufacturing-site-material-change-change-to-overmold-ewlb-process-stats-chippac-reason-for-revision-removing-device-description-document.html",
	"url": "https://intel.pcn.captnemo.in/pcn/805401",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/805401.json"
}