{
	"title": "Intel(R) Server System R2208WFQZSR, PCN 118993-00, Product Material, Product Design, New Alternate Hot Swap Backplane and Gasket implementation in 2.5" tool less carrier",
	"id": "803552",
	"created_at": "2023-12-19T18:13:46+00:00",
	"modified_at": "2022-03-28T22:00:00+00:00",
	"description": "Server Boards and Platforms, Server Chassis, Product Material, Intel anticipates no impact to customers, see PCN detail for further information.",
	"download_url": "https://cdrdv2-public.intel.com/803552/PCN118993-00.pdf",
	"html_url": "https://intel.com/content/www/us/en/content-details/803552/intel-r-server-system-r2208wfqzsr-pcn-118993-00-product-material-product-design-new-alternate-hot-swap-backplane-and-gasket-implementation-in-2-5-tool-less-carrier.html",
	"url": "https://intel.pcn.captnemo.in/pcn/803552",
	"category": "Product Change Notifications (PCN)",
	"self": "https://intel.pcn.captnemo.in/api/803552.json"
}